Thermal Grizzly Putty Basic 30g – High Performance Thermal Putty

The Thermal Grizzly Putty Basic 30g is a high-performance thermal interface putty designed for efficient heat transfer in compact electronic devices and high-density components. Unlike standard thermal pastes, thermal putty is a moldable compound that adapts to uneven surfaces, ensuring excellent contact between heat-generating components and heatsinks.

With its high thermal conductivity and easy application, the Putty Basic is ideal for use in laptops, VRMs, chipsets, memory modules, gaming consoles, and embedded devices where space is limited and airflow is restricted. The 30g bulk packaging makes it a cost-effective option for technicians, system builders, and repair professionals who require reliable thermal performance across multiple applications.

Safe, non-conductive, and non-corrosive, the Thermal Grizzly Putty Basic 30g offers long-lasting stability, making it an excellent solution for maintaining low operating temperatures and extending the lifespan of sensitive electronics.

Key Features

• High thermal conductivity – efficient heat transfer for compact components

• Flexible application – adapts to uneven or irregular surfaces

• 30g container – bulk size for multiple applications and professional use

• Safe for electronics – non-conductive and non-corrosive formula

• Durable performance – long-lasting stability and resistance to drying

• Ideal for laptops, VRMs, memory, and chipsets

• Perfect for technicians and repair professionals

Specifications

• Model: Thermal Grizzly Putty Basic

• Type: Thermal Putty (interface compound)

• Quantity: 30g

• Thermal Conductivity: High (optimized for compact devices)

• Electrical Conductivity: Non-conductive

• Application: Laptops, VRMs, memory, chipsets, embedded devices

• Shelf Life: ~3 years (sealed)

• Warranty: Not applicable (consumable product)