Thermal Grizzly Putty Advance 30g – High Performance Thermal Putty for Laptops/GPUs

The Thermal Grizzly Putty Advance 30g is a premium thermal interface putty engineered for advanced cooling performance in compact devices and high-density components. Compared to the Basic version, the Putty Advance delivers higher thermal conductivity and improved adaptability, making it ideal for demanding applications such as gaming laptops, VRMs, memory modules, GPUs, and embedded systems.

Thanks to its moldable and flexible nature, Putty Advance fills gaps and irregular surfaces between components and heatsinks, ensuring maximum surface contact and optimized heat transfer. The 30g container provides a bulk solution for technicians, PC builders, and repair professionals who require reliable cooling performance across multiple devices.

Non-conductive, non-corrosive, and stable over time, the Thermal Grizzly Putty Advance 30g ensures consistent cooling efficiency, helping to reduce thermal throttling, improve stability, and extend component lifespan in performance-critical systems.

Key Features

• Enhanced thermal conductivity – superior to Putty Basic for high-performance needs

• Flexible, moldable compound – perfect for uneven surfaces and compact devices

• 30g container – bulk size for multiple uses and professional applications

• Safe for electronics – non-conductive and non-corrosive formulation

• Long-lasting stability – resists drying out, ensures consistent performance

• Optimized for gaming laptops, VRMs, memory, and GPUs

• Ideal for enthusiasts, technicians, and repair workshops

Specifications

• Model: Thermal Grizzly Putty Advance

• Type: Thermal Putty (interface compound)

• Quantity: 30g

• Thermal Conductivity: Higher than Putty Basic (optimized for performance-critical systems)

• Electrical Conductivity: Non-conductive

• Application: Laptops, GPUs, VRMs, memory modules, chipsets, embedded devices

• Shelf Life: ~3 years (sealed)

• Warranty: Not applicable (consumable product)